Please use this identifier to cite or link to this item: http://dspace.univ-bouira.dz:8080/jspui/handle/123456789/6391
Title: Electrocoagulation of chemical mechanical polishing wastewater
Authors: Lounici, Hakim
Keywords: Electrocoagulation; Chemical mechanical polishing wastewater; Wafer
Issue Date: Oct-2006
Publisher: universite de bouira
Citation: Elsevier Science
Abstract: Treatment of chemical mechanical polishing (CMP) wastewater was investigated. The CMP wastewater, as obtained from surface treatment of photovoltaic wafers, was characterized by high suspended solids, high nephelometric turbidity unit (NTU), chemical oxygen demand (COD) and green color. This study determines the feasibility of CMP wastewater treatment by the electrocoagulation process. The COD concentration of the CMP wastewater was found in the range of 700 mg/l which is below the discharge standards. The analysis of the wastewater before and after electrocoagulation shows that the electrochemical process was a total barrier for the metal species, color and a significant reduction in the concentration of the fluoride and sulfate ions.
URI: http://dspace.univ-bouira.dz:8080/jspui/handle/123456789/6391
Appears in Collections:Articles

Files in This Item:
File Description SizeFormat 
h8.pdf297,86 kBAdobe PDFView/Open


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.