Veuillez utiliser cette adresse pour citer ce document : http://dspace.univ-bouira.dz:8080/jspui/handle/123456789/6391
Affichage complet
Élément Dublin CoreValeurLangue
dc.contributor.authorLounici, Hakim-
dc.date.accessioned2019-11-20T10:05:28Z-
dc.date.available2019-11-20T10:05:28Z-
dc.date.issued2006-10-
dc.identifier.citationElsevier Scienceen_US
dc.identifier.urihttp://dspace.univ-bouira.dz:8080/jspui/handle/123456789/6391-
dc.description.abstractTreatment of chemical mechanical polishing (CMP) wastewater was investigated. The CMP wastewater, as obtained from surface treatment of photovoltaic wafers, was characterized by high suspended solids, high nephelometric turbidity unit (NTU), chemical oxygen demand (COD) and green color. This study determines the feasibility of CMP wastewater treatment by the electrocoagulation process. The COD concentration of the CMP wastewater was found in the range of 700 mg/l which is below the discharge standards. The analysis of the wastewater before and after electrocoagulation shows that the electrochemical process was a total barrier for the metal species, color and a significant reduction in the concentration of the fluoride and sulfate ions.en_US
dc.language.isoenen_US
dc.publisheruniversite de bouiraen_US
dc.subjectElectrocoagulation; Chemical mechanical polishing wastewater; Waferen_US
dc.titleElectrocoagulation of chemical mechanical polishing wastewateren_US
dc.typeArticleen_US
Collection(s) :Articles

Fichier(s) constituant ce document :
Fichier Description TailleFormat 
h8.pdf297,86 kBAdobe PDFVoir/Ouvrir


Tous les documents dans DSpace sont protégés par copyright, avec tous droits réservés.